Equipment for Alternative Energy Silicon wafers
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Technical characteristics
- BrandAlternative
Description
FPSC have the latest wire saw technology available, capable of producing up to 155 micron-thin silicon wafers, and fully-automated cleaning systems and automated inspection systems. The companies pride themselves in having quick cycle time with customized packaging, labeling and shipping, and a strong R&D optimizing process, equipment and materials.
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Equipment for Alternative Energy Silicon wafers
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